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Flex/Chip on Flex

Military Flex Board

Military Layers: 8 Trace/Space: .0035″ / .0035″ Finish: HASL              Differential Controlled Impedance

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Chip on Flex

High-Energy Particle Detector Layers: 2 Trace/Space: 2/2 (50/50 µm) Materials: 2 mil thick DuPont AP Flex Finish: Immersion Au over Ni              Selective Plating Soldermask: Flexible LPI

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Flex Board

Compunetics is the only manufacturer to make flex with 4 steps of selective plating. This process creates bumplets that enable mechanical connection with an absolute minimum of force. Specifications Layers: 3 Trace/Space: 4 Steps Of […]

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