With 20 years of experience, Compunetics is a pioneer in very high density circuitry. It is one of only a few PCB manufacturers in the world to make these versatile boards for specialized applications and unusual physical constraints. Compunetics has become the vendor of choice when requirements include very high density interconnects.
Variable Thickness
One interesting aspect of multilayer flex boards is the ability to have different cross-sections in different areas of the board. Let’s say you need 6 layers in one section but then have to “slim down” […]
Stiffeners, Heatsinks, Shields and Heaters
A multitude of things can be added to a “simple” single or double sided flex to enhance form, fit and function. Mechanical stiffeners bonded to one or both sides can be designed to match virtually […]
Flying Leads
Flying leads are one of the unique benefits that can be used on single and double sided flex board designs. The circuit traces become the interconnect to the next board, no connectors required. Just unsupported […]
Dynamic Flex
One and two layer flex boards are ideally suited for dynamic motion. From a device that requires only a few hundred cycles over its lifetime like a hinged panel that opens only for maintenance or […]
Small, Thin and Lightweight
Working with ultra-thin substrates requires tools that are not commonly found in every PCB shop but once you have those tools at your disposal you can achieve results that are hard to match. Think of […]
MCM — Multi-Chip Modules
Layers: 4 Material: High Tg FR4 Trace Width: 0.0015 +/-0.0003” Surface Finish: Wirebondable Electrolytic Gold and Nickel Layers: 8 Materials: Thermount/Polyimide (Arlon 85N) Trace Width: 0.002 +/- 0.0003” Stacked Microvias: L1 to L2 to L3; […]
Chip Carriers
High density packaging for the most complex die Specifications Layers: 4 Trace/Space: 3/2 (75/50 µm) Board Features:Electrolytic Ni/Au Bonded Heat Spreader Edge Plating Blind Microvias Material: High Tg FR4
Satellite Systems
Specifications Layers: 12 Trace/Space: 6/6 (150/150 µm) Finish: Immersion Gold Material: Polyimide Rigid DuPont AP Flex
Military
Specifications Layers: 22 ‘Looseleaf’ Design Material: Polyimide Rigid DuPont AP Flex Certifications: IPC-6013 Class III Surface Finish: HAL
Ordinates Control
Specifications Layers: 10 with 6 layers flex Finish: 2-Ounce Copper Military Specification Design: Compunetics Drafting Department
Avionics
Specifications Layers: 8 ‘Looseleaf’ Design Board Features: 3 Double-Sided Flex Cores with Coverlay 2-Ounce Copper on Flex Military Specification
Silicon Testing
Specifications Layers: 14 rigid; 3 flex Material: High Speed FR4 (Isola 408) Dupont AP Flex material Trace Width: 0.002 +/- 0.0003” Controlled Impedance (64 ohms +/- 10%) Buried resistors (400 each of Ohmega Ply 60 […]
Military Flex Board
Military Layers: 8 Trace/Space: .0035″ / .0035″ Finish: HASL Differential Controlled Impedance
Chip on Flex
High-Energy Particle Detector Layers: 2 Trace/Space: 2/2 (50/50 µm) Materials: 2 mil thick DuPont AP Flex Finish: Immersion Au over Ni Selective Plating Soldermask: Flexible LPI
Flex Board
Compunetics is the only manufacturer to make flex with 4 steps of selective plating. This process creates bumplets that enable mechanical connection with an absolute minimum of force. Specifications Layers: 3 Trace/Space: 4 Steps Of […]
3M C-Ply™ and DuPont Interra™ HK
3M’s C-Ply material’s high capacitive density enables it to perform the power supply decoupling function and eliminate discrete capacitors. This capability makes it especially beneficial for high-end equipment in the telecommunications, computer, test and measurement, […]
Ohmega-Ply® and TCR®
Ohmega-Ply®, manufactured by Ohmega Technologies, Inc. and TCR®, manufactured by Ticer Technologies, LLC, are thin film resistor-conductor materials. Using standard subtractive printed circuit technology, integral resistors are formed on circuit layers. These resistors can be […]
Fine Lines
Specifications Layers: 4 Trace/Space: 1.5/1.5 (35/35 µm) Finish: Electrolytic Ni/Au Thickness: 31 ±
High Layer Fine Line
Specifications Layers: 14 Trace/Space: 2/2 (50/50 µm) Finish: Electrolytic Ni/Au Thickness: Electrolytic Gold Blind Vias Cavity Design 2 Buried Resistor Layers
High Speed Ethernet
Designed for high speed networking (10 Gig Ethernet Card) Specifications: IPC-6012 Class III Layers: 8 Trace/Space: Rogers 4003/FR4 Mix Board Features: Blind Vias 1-4 for Stub Length Control Via-In-Pad using Conductive Epoxy 2 Level “Cavity” […]
Calibration Network
Designed for high speed military radar Specifications Layers: 4 Material: Rogers 6002, 4350, 4403 Drilling: Blind 1-to-2; 4-to-3; 1-to-3; Buried 2-to-3 Cavity: 4-to-3 Trace Width: 10 mils Tolerance: +/- 0.0003” Surface Finish: Electrolytic Nickel and […]
RF Interface
Designed for wireless communications Specifications Layers: 2 Material: Rogers 3003 Trace Width: 10 Tolerance: +/- 0.0003” Precision laser routed slots Finish: Electrolytic Nickel and Gold