Avionics
Specifications Layers: 8 ‘Looseleaf’ Design Board Features: 3 Double-Sided Flex Cores with Coverlay 2-Ounce Copper on Flex Military Specification
Silicon Testing
Specifications Layers: 14 rigid; 3 flex Material: High Speed FR4 (Isola 408) Dupont AP Flex material Trace Width: 0.002 +/- 0.0003” Controlled Impedance (64 ohms +/- 10%) Buried resistors (400 each of Ohmega Ply 60 […]
Military Flex Board
Military Layers: 8 Trace/Space: .0035″ / .0035″ Finish: HASL Differential Controlled Impedance
Chip on Flex
High-Energy Particle Detector Layers: 2 Trace/Space: 2/2 (50/50 µm) Materials: 2 mil thick DuPont AP Flex Finish: Immersion Au over Ni Selective Plating Soldermask: Flexible LPI
Flex Board
Compunetics is the only manufacturer to make flex with 4 steps of selective plating. This process creates bumplets that enable mechanical connection with an absolute minimum of force. Specifications Layers: 3 Trace/Space: 4 Steps Of […]
3M C-Ply™ and DuPont Interra™ HK
3M’s C-Ply material’s high capacitive density enables it to perform the power supply decoupling function and eliminate discrete capacitors. This capability makes it especially beneficial for high-end equipment in the telecommunications, computer, test and measurement, […]
Ohmega-Ply® and TCR®
Ohmega-Ply®, manufactured by Ohmega Technologies, Inc. and TCR®, manufactured by Ticer Technologies, LLC, are thin film resistor-conductor materials. Using standard subtractive printed circuit technology, integral resistors are formed on circuit layers. These resistors can be […]
Fine Lines
Specifications Layers: 4 Trace/Space: 1.5/1.5 (35/35 µm) Finish: Electrolytic Ni/Au Thickness: 31 ±
High Layer Fine Line
Specifications Layers: 14 Trace/Space: 2/2 (50/50 µm) Finish: Electrolytic Ni/Au Thickness: Electrolytic Gold Blind Vias Cavity Design 2 Buried Resistor Layers
High Speed Ethernet
Designed for high speed networking (10 Gig Ethernet Card) Specifications: IPC-6012 Class III Layers: 8 Trace/Space: Rogers 4003/FR4 Mix Board Features: Blind Vias 1-4 for Stub Length Control Via-In-Pad using Conductive Epoxy 2 Level “Cavity” […]